Technische Universität Berlin - Faculty IV - Institute of High-Frequency and Semiconductor System Technologies
Research Assistant - salary grade E13 TV-L Berliner Hochschulen
part-time employment may be possible
Within a third-party funded research project the TU Berlin will develop cost effective packaging technologies for delicate sensors. The focus of TU Berlin research will be the integration of the sensor packages into new miniaturized medical diagnostic devices.
Successfully completed university degree (Master, Diplom or equivalent) in Electrical Engineering / Mechanical Engineering / Micro System Technologies / Material Science or similar
Knowledge and experience with:
a) Modern microelectronic assembly such as SMD assembly (including reflow soldering), flip-chip technology, etc., programming of assembly machines and process development for packaging
b) Technologies and materials of microsystem technology and microelectronic; experience in the field of transfer molding / compression molding is an advantage
very good command of German and English (written and spoken)
independent and well-structured working method
willingness to accept responsibilities for different tasks
ability to work in a team, willingness for documentation tasks
How to apply:
Please send your written application with the reference number and the usual documents to Technische Universität Berlin - Der Präsident - Fakultät IV, Forschungsschwerpunkt Technologien der Mikroperipherik, Prof. Dr. Schneider-Ramelow, Sekr. TIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin or by e-mail to firstname.lastname@example.org.
To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired.
Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities.
Please send copies only. Original documents will not be returned.