Offer 390 out of 627 from 28/09/21, 13:49


Tech­ni­sche Uni­ver­si­tät Dres­den - Cen­ter for Advan­cing Elec­tro­nics Dres­den

The TU Dres­den is one of ele­ven Ger­man uni­ver­si­ties that were iden­ti­fied as an “excel­lence uni­ver­sity”. TUD has about 36.500 stu­dents and almost 5319 employees, 507 pro­fes­sors among them, and, thus, is the lar­gest uni­ver­sity in Sax­ony, today.

Having been com­mit­ted to sci­en­ces and the engi­nee­ring before the reuni­fi­ca­tion of Ger­many, TU Dres­den now is a multi-disci­pline uni­ver­sity, also offe­ring huma­nities and social sci­en­ces as well as medi­cine.

Rese­arch Asso­ciate

(sub­ject to per­so­nal qua­li­fi­ca­tion employees are remu­ne­ra­ted accord­ing to salary group E 13 TV-L)
The rese­arch group Meso­scopic 3D Sys­tems offers a pro­ject posi­tion star­ting as soon as poss­bile. The posi­tion is limi­ted until 31.10.2022. The period of employ­ment is gover­ned by § 2 (2) Fixed Term Rese­arch Con­tracts Act (Wis­sen­schafts­zeit­ver­trags­ge­setz-WissZeitVG). Sub­ject to the avai­la­bi­lity of res­sour­ces, there is the pos­si­bi­lity of a term exten­sion.
We are a young start-up pro­ject in the field of high-reso­lu­tion, multi-mate­rial 3D prin­ting. For our spin-off, we have suc­cess­fully obtai­ned fun­ding from the federal EXIST rese­arch trans­fer pro­gram. A coope­ra­tion wit­hin the plan­ned later startup is expli­citly desi­red.

Working field:

  • Deve­lop­ment and design of inno­va­tive assem­blies and pre­cision com­pon­ents wit­hin a rese­arch pro­ject,
  • Deve­lop­ment of new solu­ti­ons at the inter­di­sci­pli­nary inter­face of mecha­nics, flui­dics and elec­tro­nics,
  • Pre­pa­ra­tion of inde­pen­dent design stu­dies and com­pi­ling of tech­ni­cal drawings inclu­ding the exe­cu­tion of cal­cu­la­ti­ons and veri­fi­ca­ti­ons,
  • Pre­pa­ra­tion of com­plete design docu­men­ta­tion (CAD/CAM) inclu­ding drawing and deve­lop­ment docu­men­ta­tion,
  • Estab­lish­ment of a new sys­tem for the ent­ire tech­ni­cal pro­duct docu­men­ta­tion (e.g. pro­cess stan­dar­di­za­tion, com­po­nent lists, parts lists),
  • Assign­ment and super­vi­sion of all manu­fac­tu­ring steps (inter­nal and exter­nal),
  • Respon­si­bi­lity of all deve­lo­ped solu­ti­ons in the design review pro­cess,
  • Respon­si­bi­lity of the assi­gned pro­ject bud­get,
  • Pre­sen­ta­tion of inno­va­tive results at sci­en­ti­fic con­fe­ren­ces and mee­tings.


We are loo­king for a moti­va­ted and team-ori­en­ted expert in the field of pre­cision mecha­nics with a focus on device deve­lop­ment (mecha­nics + elec­tro­nics) to join our rese­arch and deve­lop­ment team. Expec­ted are
  • very good uni­ver­sity degree in the field of mecha­ni­cal engi­nee­ring, elec­tri­cal engi­nee­ring or com­pa­ra­ble cour­ses of study,
  • ver­sa­tile abi­lity to work under pres­sure with enthu­si­asm, being inno­va­tive and having a high level of inde­pen­dence,
  • abi­lity to work in a team and being open in com­mu­ni­ca­tion,
  • rele­vant expe­ri­ence in the field of device deve­lop­ment as well as various pre­cision manu­fac­tu­ring tech­ni­ques,
  • pro­ven expe­ri­ence with 3D CAD sys­tems (pre­fer­a­bly Auto­desk Inven­tor),
  • basic know­ledge of fluid dyna­mics and poly­mer mate­ri­als,
  • very good writ­ten and spo­ken Eng­lish skills for con­fi­dent tech­ni­cal com­mu­ni­ca­tion with team mem­bers as well as exter­nal part­ners,
  • wil­ling­ness to tra­vel moder­ately in an inter­na­tio­nal envi­ron­ment,
  • good com­mu­ni­ca­tion skills (inclu­ding for the pre­sen­ta­tion of results at inter­na­tio­nal sci­en­ti­fic mee­tings and trade fairs as well as to capi­tal pro­vi­ders/inves­tors).
  • Ide­ally, expe­ri­ence in sci­en­ti­fic or high-tech device engi­nee­ring is already avail­able from your side

What we offer:

We offer a crea­tive and dyna­mic envi­ron­ment with exten­sive respon­si­bi­lity in a young team wit­hin an inter­na­tio­nally com­pe­ti­tive rese­arch area.
App­li­ca­ti­ons from women are par­ti­cu­larly wel­come. The same app­lies to people with disa­bi­li­ties.

How to apply:

Please sub­mit your com­pre­hen­sive app­li­ca­tion inclu­ding the usual docu­ments by Octo­ber 28, 2021 (stam­ped arri­val date of the uni­ver­sity cen­tral mail ser­vice app­lies) pre­fer­a­bly via the TU Dres­den Secu­re­Mail Por­tal by sen­ding it as a sin­gle pdf docu­ment to or by mail to: TU Dres­den, Cen­ter for Advan­cing Elec­tro­nics Dres­den, z. Hd. Dr. Robert Kirch­ner, Helm­holtz­str. 10, 01069 Dres­den, Ger­many. Please sub­mit copies only, as your app­li­ca­tion will not be retur­ned to you. Expen­ses incur­red in atten­ding inter­views can­not be reim­bur­sed.

Refe­rence to data pro­tec­tion: Your data pro­tec­tion rights, the pur­pose for which your data will be pro­ces­sed, as well as fur­ther infor­ma­tion about data pro­tec­tion is avail­able to you on the web­site: