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Tech­ni­sche Uni­ver­si­tät Dres­den - Faculty of Elec­tri­cal and Com­pu­ter Engi­nee­ring, Insti­tute of Semi­con­duc­tors and Micro­sys­tems, Chair of Micro­sys­tems

Tech­ni­sche Uni­ver­si­tät Dres­den as a Uni­ver­sity of Excel­lence is one of the lea­ding uni­ver­si­ties in Ger­many, and is ran­ked among the 100 most inno­va­tive uni­ver­si­ties world­wide. Its dis­tin­guis­hing fea­ture is a strong focus on rese­arch as well as its diver­si­fied offer of more than 120 degree pro­grams in Engi­nee­ring Sci­en­ces, Natu­ral Sci­en­ces, Huma­nities & Social Sci­en­ces and Medi­cine.

It pur­sues a long-term over­all deve­lop­ment pro­gram aimed at making TU Dres­den an inter­na­tio­nal top uni­ver­sity.

Rese­arch Asso­ciate (m/f/x)

(sub­ject to per­so­nal qua­li­fi­ca­tion employees are remu­ne­ra­ted accord­ing to salary group E 13 TV-L)

At TU Dres­den, Faculty of Elec­tri­cal and Com­pu­ter Engi­nee­ring, Insti­tute of Semi­con­duc­tors and Micro­sys­tems, the Chair of Micro­sys­tems offers a pro­ject posi­tion in the Emmy Nöther Junior Rese­arch Group "MEiT­NER - Mul­ti­func­tio­nal dielec­tric elas­to­mer elec­tro­nics for next genera­tion soft robo­tics", star­ting as soon as pos­si­ble, limi­ted to two years, with the option for exten­sion. The period of employ­ment is gover­ned by §2 (2) the Fixed Term Rese­arch Con­tracts Act (Wis­sen­schafts­zeit­ver­trags­ge­setz – WissZeitVG.

The Chair of Micro­sys­tems offers the oppor­tu­nity to par­ti­ci­pate in the deve­lop­ment of mul­ti­func­tio­nal dielec­tric elas­to­mers for mul­ti­func­tio­nal and intel­li­gent machine ele­ments and robo­tics in a pros­pe­rous and dyna­mic envi­ron­ment and with excel­lently equip­ped labo­ra­to­ries and to gain valu­able pro­ject expe­ri­ence in an inter­di­sci­pli­nary envi­ron­ment.

Working field:

Wit­hin the scope of the coope­ra­tion pro­ject "Elastic cou­plings with inte­gra­ted fle­xi­ble dielec­tric elas­to­mer sen­sors" in the DFG prio­rity pro­gram 2305 "Sen­sor-inte­gra­ting machine ele­ments", novel intel­li­gent cou­plings, which are able to mea­sure and trans­mit various load and per­for­mance para­me­ters at run­time, are to be deve­lo­ped in coope­ra­tion with the Chair of Mecha­nics of Mul­ti­func­tio­nal Struc­tures and the Chair of Machine Ele­ments. At the Chair of Micro­sys­tems con­cepts for fle­xi­ble sen­sor elec­tro­nics based on dielec­tric elas­to­mers as well as the necessary manu­fac­tu­ring tech­no­lo­gies and mate­ri­als, espe­ci­ally elec­tri­cally con­duc­tive inks, are to be deve­lo­ped and inte­gra­ted into the elas­to­mer com­pon­ents to be deve­lo­ped for smart cou­plings. Your tasks will include the deve­lop­ment of fle­xi­ble pres­sure sen­sors based on pie­zo­re­sis­tive dielec­tric elas­to­mers, the adap­tation of exis­ting manu­fac­tu­ring tech­no­lo­gies and the deve­lop­ment and con­nec­tion of the eva­lua­tion elec­tro­nics. You will be sup­por­ted by the inter­di­sci­pli­nary team of the Emmy Nöther Young Inves­ti­ga­tors Group MEiT­NER and the pro­ject part­ners. The sen­sor deve­lop­ment and the con­struc­tive imple­men­ta­tion are sup­por­ted by nume­ri­cal simu­la­ti­ons of the col­leagues at the Chair of Mecha­nics of Mul­ti­func­tio­nal Struc­tures. The resul­ting demons­tra­tors will be manu­fac­tu­red and tested in the test stands at the Chair of Micro­sys­tems. The results of the work are to be published at inter­na­tio­nal con­fe­ren­ces and in reco­gni­zed jour­nals.

Requirements:

above-average uni­ver­sity degree in the fields of elec­tri­cal engi­nee­ring, micro­sys­tems engi­nee­ring, che­mi­cal engi­nee­ring, mate­ri­als sci­ence or rela­ted fields and expe­ri­ence in the areas of tech­no­logy deve­lop­ment in micro­sys­tems engi­nee­ring, bio­nics and soft robo­tics; abi­lity to work inde­pendently; goal-ori­en­ted; high level of com­mit­ment; wil­ling­ness to tra­vel inter­na­tio­nally; con­fi­dent com­mand of the Eng­lish lan­guage as well as enjoy­ment and inte­rest in prac­tice-ori­en­ted, inter­di­sci­pli­nary col­la­bo­ra­tion with coope­ra­tion part­ners. Expe­ri­ence in at least the fields of micro­sys­tems engi­nee­ring, bio- or con­ti­nuum mecha­nics, micro­tech­no­lo­gies and cir­cuit design is an advan­tage.

How to apply:

App­li­ca­ti­ons from women are par­ti­cu­larly wel­come. The same app­lies to people with disa­bi­li­ties.

Please sub­mit your com­pre­hen­sive app­li­ca­tion inclu­ding the usual docu­ments by Decem­ber 17, 2021 (stam­ped arri­val date of the uni­ver­sity cen­tral mail ser­vice app­lies), by mail to: TU Dres­den, Fakul­tät Elek­tro­tech­nik und Infor­ma­ti­ons­tech­nik, Insti­tut für Halb­lei­ter- und Mikro­sys­tem­tech­nik, Pro­fes­sur für Mikro­sys­tem­tech­nik, z.Hd. Herrn Dr. E.-F. Mar­kus Henke, Helm­holtz­str. 10, 01069 Dres­den or via the TU Dres­den Secu­re­Mail Por­tal https://securemail.tu-dresden.de by sen­ding it as a sin­gle pdf docu­ment to markus.henke@tu-dresden.de. Please sub­mit copies only, as your app­li­ca­tion will not be retur­ned to you. Expen­ses incur­red in atten­ding inter­views can­not be reim­bur­sed.

Refe­rence to data pro­tec­tion: Your data pro­tec­tion rights, the pur­pose for which your data will be pro­ces­sed, as well as fur­ther infor­ma­tion about data pro­tec­tion is avail­able to you on the web­site: https://tu-dresden.de/karriere/datenschutzhinweis